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ADV7181DWBCPZ-RL Fiches technique(PDF) 9 Page - Analog Devices |
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ADV7181DWBCPZ-RL Fiches technique(HTML) 9 Page - Analog Devices |
9 / 24 page Data Sheet ADV7181D Rev. 0 | Page 9 of 24 ABSOLUTE MAXIMUM RATINGS PACKAGE THERMAL PERFORMANCE Table 5. Parameter Rating AVDD to GND 4 V DVDD to GND 2.2 V PVDD to GND 2.2 V DVDDIO to GND 4 V DVDDIO to AVDD −0.3 V to +0.3 V PVDD to DVDD −0.3 V to +0.3 V DVDDIO to PVDD −0.3 V to +2 V DVDDIO to DVDD −0.3 V to +2 V AVDD to PVDD −0.3 V to +2 V AVDD to DVDD −0.3 V to +2 V Digital Inputs to GND GND − 0.3 V to DVDDIO + 0.3 V Digital Outputs to GND GND − 0.3 V to DVDDIO + 0.3 V Analog Inputs to GND GND − 0.3 V to AVDD + 0.3 V Operating Temperature Range −40°C to +85°C Maximum Junction Temperature (TJ MAX) 125°C Storage Temperature Range −65°C to +150°C Infrared Reflow, Soldering (20 sec) 260°C To reduce power consumption when using the part, turn off any unused ADCs. It is imperative that the recommended scripts be used for the following high current modes: SCART, 720p, 1080i, and all RGB graphic standards. Using the recommended scripts ensures correct thermal performance. These scripts are available from a local field applications engineer (FAE). The junction temperature must always stay below the maximum junction temperature (TJ MAX) of 125°C. The junction temperature can be calculated by TJ = TA MAX + (θJA × WMAX) where: TA MAX = 85°C. θJA = 20.3°C/W. WMAX = ((AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO) + (PVDD × IPVDD)) THERMAL RESISTANCE Table 6 specifies the typical values for the junction-to-ambient thermal resistance (θJA) and the junction-to-case thermal resis- tance (θJC) for an ADV7181D soldered on a 4-layer PCB with solid ground plane. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 6. Thermal Resistance Package Type θJA1 θJC Unit 64-Lead LFCSP (CP-64-3) 20.3 1.2 °C/W 1 In still air. REFLOW SOLDER The ADV7181D is a Pb-free, environmentally friendly product. It is manufactured using the most up-to-date materials and pro- cesses. The coating on the leads of each device is 100% pure Sn electroplate. The device is suitable for Pb-free applications and can withstand surface-mount soldering at up to 255°C ± 5°C. ESD CAUTION In addition, the ADV7181D is backward-compatible with conventional SnPb soldering processes. This means that the electroplated Sn coating can be soldered with Sn/Pb solder pastes at conventional reflow temperatures of 220°C to 235°C. |
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Description similaire - ADV7181DWBCPZ-RL |
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