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AD6657ABBCZRL Fiches technique(PDF) 11 Page - Analog Devices

No de pièce AD6657ABBCZRL
Description  Quad IF Receiver
Download  36 Pages
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Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD6657ABBCZRL Fiches technique(HTML) 11 Page - Analog Devices

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Data Sheet
AD6657A
Rev. 0 | Page 11 of 36
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to AGND
−0.3 V to +2.0 V
VIN+x, VIN−x to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND
−0.3 V to AVDD + 0.2 V
SYNC to AGND
−0.3 V to AVDD + 0.2 V
VCMx to AGND
−0.3 V to AVDD + 0.2 V
CSB to AGND
−0.3 V to DRVDD + 0.2 V
SCLK to AGND
−0.3 V to DRVDD + 0.2 V
SDIO to AGND
−0.3 V to DRVDD + 0.2 V
PDWN to AGND
−0.3 V to DRVDD + 0.2 V
MODE to AGND
−0.3 V to DRVDD + 0.2 V
Digital Outputs to AGND
−0.3 V to DRVDD + 0.2 V
DCO+AB, DCO−AB, DCO+CD,
DCO−CD to AGND
−0.3 V to DRVDD + 0.2 V
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +150°C
THERMAL CHARACTERISTICS
The values in Table 7 are per JEDEC JESD51-7 and JEDEC
JESD25-5 for a 2S2P test board. Typical θJA is specified for a
4-layer printed circuit board (PCB) with a solid ground plane.
As shown in Table 7, airflow improves heat dissipation, which
reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces θJA.
Table 7.
Package Type
Airflow
Velocity
θJA1
θJC2
θJB3
Unit
144-Ball CSP_BGA
0 m/s
26.9
8.9
6.6
°C/W
1 m/s
24.2
°C/W
2.5 m/s
23.0
°C/W
1 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
2 Per MIL-STD 883, Method 1012.1.
3 Per JEDEC JESD51-8 (still air).
The values in Table 8 are from simulations. The PCB is a JEDEC
multilayer board. Thermal performance for actual applications
requires careful inspection of the conditions in the application
to determine whether they are similar to those assumed in these
calculations.
Table 8.
Package Type
Airflow
Velocity
JB
JT
Unit
144-Ball CSP_BGA
0 m/s
14.4
0.23
°C/W
1 m/s
14.0
0.50
°C/W
2.5 m/s
13.9
0.53
°C/W
ESD CAUTION
Stresses abovethose listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum ratingconditionsfor extended periodsmay affect
device reliability.


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