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AD5755-1 Fiches technique(PDF) 6 Page - Analog Devices |
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AD5755-1 Fiches technique(HTML) 6 Page - Analog Devices |
6 / 20 page AD5700/AD5700-1 Data Sheet Rev. A | Page 6 of 20 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. Table 4. Parameter Rating VCC to GND −0.3 V to +7 V IOVCC to GND −0.3 V to +7 V Digital Inputs to DGND −0.3 V to IOVCC + 0.3 V or +7 V (whichever is less) Digital Output to DGND −0.3 V to IOVCC + 0.3 V or +7 V (whichever is less) HART_OUT to AGND −0.3 V to +2.5 V HART_IN to AGND −0.3 V to VCC + 0.3 V or +7 V (whichever is less) ADC_IP −0.3 V to VCC + 0.3 V or +7 V (whichever is less) AGND to DGND −0.3 V to +0.3 V Operating Temperature Range (TA) Industrial −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ MAX) 150°C Power Dissipation (TJ MAX – TA)/θJA Lead Temperature, JEDEC industry standard Soldering J-STD-020 ESD Human Body Model (ANSI/ESDA/JEDEC JS-001-2010) 8 kV Field Induced Charge Model (JEDEC JESD22_C101E) 1.5 kV Machine Model (ANSI/ESD S5.2-2009) 400 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 5. Thermal Resistance Package Type θJA θJC Unit 24-Lead LFCSP 30 3 °C/W ESD CAUTION |
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