Moteur de recherche de fiches techniques de composants électroniques |
|
Z0107MN Fiches technique(PDF) 6 Page - NXP Semiconductors |
|
Z0107MN Fiches technique(HTML) 6 Page - NXP Semiconductors |
6 / 15 page Z0107MN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 05 — 21 March 2011 6 of 15 NXP Semiconductors Z0107MN 4Q Triac 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle; see Figure 8 --15 K/W Rth(j-a) thermal resistance from junction to ambient full cycle; printed circuit board mounted: minimum footprint; see Figure 6 - 156 - K/W full cycle; printed circuit board mounted: pad area; see Figure 7 -70 - K/W All dimensions are in mm All dimensions are in mm Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick) Fig 6. Minimum footprint SOT223 Fig 7. Printed circuit board pad area: SOT223 001aab508 3.8 min 1.5 min 1.5 min (3 ×) 2.3 4.6 6.3 1.5 min 001aab509 7 4.6 15 36 9 10 18 4.5 60 50 |
Numéro de pièce similaire - Z0107MN_11 |
|
Description similaire - Z0107MN_11 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |