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SM802123UMG Fiches technique(PDF) 4 Page - Micrel Semiconductor |
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SM802123UMG Fiches technique(HTML) 4 Page - Micrel Semiconductor |
4 / 12 page Micrel, Inc. SM802123 January 2012 4 M9999-012312-A hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Supply Voltage (VDD, VDDO1/2) .....................................+4.6V Input Voltage (VIN)……….……… ........... –0.5V to VDD+0.5V Lead Temperature (soldering, 20s.)........................... 260°C Case Temperature ..................................................... 115°C Storage Temperature (Ts) .........................–65°C to +150°C Operating Ratings (2) Supply Voltage (VDD, VDDO1/2)............... +2.375V to +3.465V Ambient Temperature (TA).......................... –40°C to +85°C Junction Thermal Resistance (3) QFN ( θ JA) Still-Air ............................................................... 24°C/W QFN ( ψ JB) Junction-to-Board ................................................ 8°C/W DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C Symbol Parameter Condition Min. Typ. Max. Units VDD, VDDO1/2 3.3V Operating Voltage VDDO1 = VDDO2 3.135 3.3 3.465 V 2.5V Operating Voltage VDDO1 = VDDO2 2.375 2.5 2.625 V IDD Total supply current Outputs floating 130 170 mA LVCMOS INPUT (OE1, OE2, PLL_BYPASS) DC Electrical Characteristics (4) VDD = 3.3V ±5%, or 2.5V ±5%, TA = −40°C to +85°C Symbol Parameter Condition Min. Typ. Max. Units VIH Input High Voltage 2 VDD + 0.3 V VIN Input Low Voltage −0.3 0.8 V IIH Input High Current VDD = VIN = 3.465V 150 μA IIL Input Low Current VDD = 3.465V, VIN = 0V −150 μA LVCMOS OUTPUT DC Electrical Characteristics (4) VDD = VDDO1/2 = 3.3V ±5% or 2.5V ±5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. RL = 50Ω to VDDO/2 Symbol Parameter Condition Min. Typ. Max. Units VOH Output High Voltage Figure 4 VDDO – 0.7 V VOL Output Low Voltage Figure 4 0.6 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. 4. The circuit is designed to meet the AC and DC specifications shown in the above table after thermal equilibrium has been established. |
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