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AMC1204_1108 Fiches technique(PDF) 2 Page - Texas Instruments |
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AMC1204_1108 Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 30 page AMC1204 SBAS512B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder on www.ti.com. FAMILY OVERVIEW MODULATOR DIGITAL GAIN ERROR PART NUMBER CLOCK (MHz) SUPPLY CLOCK SOURCE INL (LSB) (%) THD (dB) AMC1203 10 5V Internal ±9 ±2 –84.5 AMC1203B 10 5V Internal ±6 ±1 –88 AMC1204 20 3V, 3.3V, or 5V External ±8 ±2 –80 ABSOLUTE MAXIMUM RATINGS (1) Over the operating ambient temperature range, unless otherwise noted. AMC1204 PARAMETER MIN MAX UNIT Supply voltage, AVDD to AGND or DVDD to DGND –0.3 +6 V Analog input voltage at VINP, VINN AGND – 0.5 AVDD + 0.5 V Digital input voltage at CLKIN DGND – 0.3 DVDD + 0.3 V Input current to any pin except supply pins –10 +10 mA Maximum virtual junction temperature, TJ +150 °C Operating ambient temperature range, TOA –40 +125 °C Human body model (HBM) –3000 +3000 V JEDEC standard 22, test method A114-C.01 Electrostatic discharge (ESD), Charged device model (CDM) –1500 +1500 V all pins JEDEC standard 22, test method C101 Machine model (MM) –200 +200 V JEDEC standard 22, test method A115A (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. THERMAL INFORMATION AMC1204 THERMAL METRIC(1) DW UNITS 16 PINS θJA Junction-to-ambient thermal resistance 78.5 θJCtop Junction-to-case (top) thermal resistance 41.3 θJB Junction-to-board thermal resistance 50.2 °C/W ψJT Junction-to-top characterization parameter 11.5 ψJB Junction-to-board characterization parameter 41.2 θJCbot Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Copyright © 2011, Texas Instruments Incorporated |
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