Document Number: 71862

S-83049-Rev. I, 22-Dec-08

www.vishay.com

5

Vishay Siliconix

Si8902EDB

PACKAGE OUTLINE

MICRO FOOT: 6 BUMP (2 x 3, 0.8 mm PITCH)

Notes (Unless Otherwise Specified):

1. 6 solder bumps are 95.5/3.8/0.7 Sn/Ag/Cu.

2. Backside surface is coated with a Ag/Ni/Ti layer.

3. Non-solder mask defined copper landing pad.

4. Laser marks on the silicon die back.

Notes:

a. Use millimeters as the primary measurement.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

reliability data, see www.vishay.com/ppg?71862.

Recommended Land

Mark on Backside of Die

e

e

6 x 0.30

0.31

Note 3

Solder Mask - 0.4

8902E

XXX

D

E

s

e

e

s

Bump Note 1

A

e

Note 2

b Diameter

e

Dim.

Inches

Min.

Max.

Min.

Max.

A

0.600

0.650

0.0236

0.0256

0.260

0.290

0.102

0.114

0.33

0.360

0.0134

0.0142

b

0.370

0.410

0.0146

0.0161

D

1.520

1.600

0.0598

0.0630

E

2.320

2.400

0.0913

0.0945

e

0.750

0.850

0.0295

0.0335

s

0.380

0.400

0.0150

0.0157