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SI7220DN-T1-GE3 Fiches technique(PDF) 8 Page - Vishay Siliconix

No de pièce SI7220DN-T1-GE3
Description  Dual N-Channel 60-V (D-S) MOSFET
Download  12 Pages
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Fabricant  VISHAY [Vishay Siliconix]
Site Internet  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SI7220DN-T1-GE3 Fiches technique(HTML) 8 Page - Vishay Siliconix

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Document Number 71681
03-Mar-06
Vishay Siliconix
AN822
PowerPAK 1212 DUAL
To take the advantage of the dual PowerPAK 1212-8’s
thermal performance, the minimum recommended
land pattern can be found in Application Note 826,
Recommended Minimum Pad Patterns With Outline
Drawing Access for Vishay Siliconix MOSFETs. Click
on the PowerPAK 1212-8 dual in the index of this doc-
ument.
The gap between the two drain pads is 10 mils. This
matches the spacing of the two drain pads on the Pow-
erPAK 1212-8 dual package.
This land pattern can be extended to the left, right, and
top of the drawn pattern. This extension will serve to
increase the heat dissipation by decreasing the ther-
mal resistance from the foot of the PowerPAK to the
PC board and therefore to the ambient. Note that
increasing the drain land area beyond a certain point
will yield little decrease in foot-to-board and foot-to-
ambient thermal resistance. Under specific conditions
of board configuration, copper weight, and layer stack,
experiments have found that adding copper beyond an
area of about 0.3 to 0.5 in2 of will yield little improve-
ment in thermal performance.
REFLOW SOLDERING
Vishay Siliconix surface-mount packages meet solder
reflow reliability requirements. Devices are subjected
to solder reflow as a preconditioning test and are then
reliability-tested using temperature cycle, bias humid-
ity, HAST, or pressure pot. The solder reflow tempera-
ture profile used, and the temperatures and time
duration, are shown in Figures 2 and 3. For the lead
(Pb)-free solder profile, see http://www.vishay.com/
doc?73257.
Ramp-Up Rate
+ 6
°C /Second Maximum
Temperature at 155 ± 15
°C
120 Seconds Maximum
Temperature Above 180
°C
70 - 180 Seconds
Maximum Temperature
240 + 5/- 0
°C
Time at Maximum Temperature
20 - 40 Seconds
Ramp-Down Rate
+ 6
°C/Second Maximum
Figure 2. Solder Reflow Temperature Profile
Figure 3. Solder Reflow Temperatures and Time Durations
210 - 220 °C
3 ° C/s (max)
4 ° C/s (max)
10 s (max)
183 °C
50 s (max)
Reflow Zone
60 s (min)
Pre-Heating Zone
3° C/s (max)
140 - 170 °C
Maximum peak temperature at 240 °C is allowed.


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