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BAS386 Fiches technique(PDF) 3 Page - Vishay Siliconix |
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BAS386 Fiches technique(HTML) 3 Page - Vishay Siliconix |
3 / 5 page BAS386 Document Number 85505 Rev. 2.0, 23-Jul-10 Vishay Semiconductors www.vishay.com 3 For technical questions within your region, please contact one of the following: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com Package Dimensions in millimeters (inches): MicroMELF Figure 5. Board for RthJA definition (in mm) 2.5 0.71 1.3 1.27 24 0.152 0.355 95 10329 Cathode indification surface plan 1 (0.039) glass 2 (0.079) 1.8 (0.071) 0.25 (0.010) 0.15 (0.006) > R2.5 (0.098) Foot print recommendation: Reflow soldering Wave soldering 2.4 (0.094) 2.8 (0.110) 0.8 (0.031) 0.8 (0.031) 0.9 (0.035) 0.9 (0.035) 0.8 (0.031) 1 (0.039) Document no.:6.560-5007.01-4 Rev. 13 - Date: 07.June.2006 96 12072 Created - Date: 26.July.1996 * * The gap between plug and glass can be either on cathode or anode side |
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Description similaire - BAS386 |
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