Moteur de recherche de fiches techniques de composants électroniques |
|
CBC050-M8C Fiches technique(PDF) 4 Page - Cymbet Corporation |
|
CBC050-M8C Fiches technique(HTML) 4 Page - Cymbet Corporation |
4 / 4 page EnerChip™ CBC050 Solid State Energy Storage ©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com DS-72-01 Rev B Page 4 of 4 Figure 1: Recommended PCB layout for the CBC050 package. Do not route signal traces under the EnerChip as they could become shorted to the die pad (as shown by the dotted lines) on the package underside. Printed Circuit Board (PCB) Layout Guidelines and Recommendations Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the board following soldering. The PCB layout can make this problem worse if the cell’s positive and negative terminals are routed near each other and under the package, where it is difficult to wash the flux residue away. To avoid this situation, make sure positive and negative traces are routed outside of the package footprint to ensure that flux residue will not cause a discharge path between the positive and negative pads. Similarly, a leakage current path can exist from the package lead solder pads to the exposed die pad on the underside of the package as well as any solder pad on the PCB that would be connected to that exposed die pad during the reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a solder pad in the region where the exposed die pad of the package will land. It is sufficient to place PCB solder pads only where the package leads will be. That region of the PCB where the exposed die pad will land must not have any solder pads, traces, or vias. When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of the package and all metal pads. Failure to observe this precaution can result in package cracking during solder reflow due to the silk screen material interfering with the solder solidification process during cooling. A recommended CBC050 PCB layout is shown in Figure 1 below. Notice that there should not be a center pad on the PCB to mate with the exposed die pad on the CBC050 package. Again, this is to reduce the possible number and severity of leakage paths between the EnerChip terminals. Dimensions in inches [mm] Cymbet, the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation. All Rights Reserved 1 2 3 4 5 7 6 8 9 10 11 12 13 14 15 16 Disclaimer of Warranties; As Is The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of dealing, course of performance, or usage of trade. Cymbet EnerChip products are not approved for use in life critical applications. Users shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and any use of the Cymbet EnerChip product described herein in any such product or applications. Soldering, Rework, and Electrical Test Refer to the Cymbet User Manual for soldering, rework, and replacement of the EnerChip on printed circuit boards, and for instructions on in-circuit electrical testing of the EnerChip. |
Numéro de pièce similaire - CBC050-M8C |
|
Description similaire - CBC050-M8C |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |