Product family data sheet

Copyright © 2008-2011 Cree, Inc. all rights reserved. The information in this document is subject to change without

notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc.

Product descriPtion

The XLamp mC-e LeD is a family

of lighting-class, multi-chip LeDs

that provides high lumen output

in a small package. Compared to

discrete LeDs, XLamp mC-e LeDs

reduce the distance between LeD

die, creating a small optical source

for excellent optical control and ef-

ficient color mixing. XLamp MC-E

LeDs can reduce LeD system com-

plexity by reducing the number of

components required.

Cree XLamp LeDs bring high perfor-

mance and quality of light to a wide

range of lighting applications, in-

cluding color-changing lighting, por-

table and personal lighting, outdoor

lighting, indoor directional lighting,

and entertainment lighting.

features

•

available in white (2600 K –

10,000 K CCT), easywhite™,

Dynamic white, or color

(RGBw)

•

aNSI-compatible neutral &

warm white chromaticity bins

•

Individually addressable LeDs

•

mC-e Dynamic white LeDs

have two cool-white (6,500 K)

and two warm-white (2,700

K) LeD die

•

mC-e easywhite LeDs avail-

able in 2 and 4-step bins, up

to 85 CRI

•

maximum drive current: 700

ma per LeD die

•

Reflow solderable – JEDEC

J-STD-020

•

electrically neutral thermal

path

•

RoHS and ReaCH-compliant

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USa Tel: +1.919.313.5300

table of contents

Flux Characteristics.................... 2

Flux Characteristics, easywhite ... 3

Characteristics -

Complete package ................. 4

Characteristics -

per LeD Die (white) ............... 4

Characteristics -

per LeD Die (Color)................ 5

Relative Spectral power Distribution

- white .................................... 5

Relative Spectral power Distribution

- Color ..................................... 5

Relative Flux Output vs Junction

Temperature ............................. 6

electrical Characteristics............. 7

Relative Intensity vs. Current ...... 7

Typical Spatial Radiation pattern .. 8

Reflow Soldering Characteristics .. 9

Notes......................................10

mechanical Dimensions..............11

Tape and Reel ..........................12

Dry packaging and packaging .....13

mc-e White

mc-e color

mc-e dynamic White