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BAS21WS Fiches technique(PDF) 1 Page - Micro Commercial Components |
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BAS21WS Fiches technique(HTML) 1 Page - Micro Commercial Components |
1 / 2 page BAS21WS High Voltage Switching Diode Features . Maximum Ratings Symbol Rating Value Unit VR Continuous Reverse Voltage 250 Vdc IF Peak Forward Current 200 mAdc IFM(surge) Peak Forward Surge Current 625 mAdc Thermal Characteristics Symbol Characteristic Max Unit PD Total Device Dissipation FR-5 Board *, TA=25 OC Derate above 25 OC 200 1.57 mW mW/ OC RJA Thermal Resistance Junction to Ambient 635 OC/W TJ,TSTG Junction and Storage Temperature Range -55 to +155 OC Electrical Characteristics @ 25OC Unless Otherwise Specified Symbol Characteristic Min Max Unit Off Characteristics IR Reverse Voltage Leakage Current (VR=200Vdc) (VR=200Vdc, TJ=150 OC) --- --- 0.1 100 uAdc V(BR) Reverse Breakdown Voltage (IBR=100uAdc) 250 --- Vdc VF Forward Voltage (IF=100mAdc) (I F=200mAdc) --- --- 1000 1250 mVdc CD Diode Capacitance (VR=0, f=1.0MHz) --- 5.0 pF trr Reverse Recovery Time (IF=IR=30mAdc, RL=100 OHM) --- 50 ns omponents 20736 Marilla Street Chatsworth !"# $% !"# M C C www.mccsemi.com TM Micro Commercial Components 1 of 2 For Surface Mount Application. . • For Surface Mount Application. . • Device Marking: JS • Lead Free Finish/RoHS Compliant("P" Suffix designates RoHS Compliant. See ordering information) *FR-5 Minimum Pad DIMENSIONS INCHES MM DIM MIN MAX MIN MAX NOTE A .090 .107 2.30 2.70 B .063 .071 1.60 1.80 C .045 .053 1.15 1.35 D .031 .045 0.80 1.15 E .010 .016 0.25 0.40 G .004 .018 0.10 0.45 H .004 .010 0.10 0.25 J ----- .006 ----- 0.15 A B E C J D H SOD-323 0.022” 0.074" 0.027” SUGGESTED SOLDER PAD LAYOUT G Revision: A 20 11/01/01 • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 |
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