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SD12CTG Fiches technique(PDF) 5 Page - Semtech Corporation |
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SD12CTG Fiches technique(HTML) 5 Page - Semtech Corporation |
5 / 7 page 5 ã 2000 Semtech Corp. www.semtech.com PRELIMINARY PROTECTION PRODUCTS SD05C THRU SD24C Device Connection Options The SDxxC TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The device is symmetrical, so there is no cathode band. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): l Place the TVS near the input terminals or connectors to restrict transient coupling. l Minimize the path length between the TVS and the protected line. l The ESD transient return path to ground should be kept as short as possible. l Place a TVS & decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. l Minimize all conductive loops including power and ground loops. l Use multilayer boards when possible. l Minimize interconnecting line lengths l Never run critical signals near board edges. l Fill unused portions of the PCB with ground plane. Device Schematic & Pin Configuration Size Comparison to 0805 MLV SOD-323 0805 MLV Note: Nominal dimensions in inches Component Placement Comparison 0805 MLV on SOD-323 on 0805 MLV Pad SOD-323 on Recommended (SOD-323) Solder Pad 0805 Solder Pad Applications Information |
Numéro de pièce similaire - SD12CTG |
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Description similaire - SD12CTG |
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