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Page 3

ESD4-LFC

SOLDER REFLOW INFORMATION

PRINTED CIRCuIT BOARD RECOMMENDATIONS

PARAMETER

vALuE

Pad Size on PCB

0.275mm

Pad Shape

Round

Pad Definition

Non-Solder Mask Defined Pads

Solder Mask Opening

0.325mm Round

Solder Stencil Thickness

0.150mm

Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)

0.330mm Round

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance - Edge To Corner Ball

±50µm

Solder Ball Side Coplanarity

±20µm

Maximum Dwell Time Above Liquidous (183°C)

60 seconds

Soldering Maximum Temperature

270°C

T

P

30-60 seconds

Ramp-up

15 seconds

(Minimize)

Solder-Time

15-20 seconds

Ramp-Down

Ramp-Down

Solder Melt

(Maximum Temp)

Maximum Solder Reflow

(35-53°C Above Maximum Solder Melt Temp)

Ramp-up

Preheat

(Stay Below Flux Activation Temp)

RECOMMENDED NON-SOLDER MASk

DEFINED PAD ILLuSTRATION

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.

REquIREMENTS

Temperature:

T

T

Preheat time and temperature depends on solder paste and flux activa-

tion temperature, component size, weight, surface area and plating.