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UC284XAY Fiches technique(PDF) 2 Page - Microsemi Corporation

No de pièce UC284XAY
Description  CURRENT MODEPWM CONTROLER
Download  8 Pages
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Fabricant  MICROSEMI [Microsemi Corporation]
Site Internet  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

UC284XAY Fiches technique(HTML) 2 Page - Microsemi Corporation

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C URRENT M ODE PWM C ONTROLLER
UC184xA/284xA/384xA
PRODUCT DA T ABOOK 1996/1997
Copyright © 1995
Rev. 1.2a 10/25
2
P RODUCTION D ATA S HEET
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (Low Impedance Source) (V
CC) ......................................................... 30V
Supply Voltage (I
CC < 30mA) .......................................................................... Self Limiting
Output Current ............................................................................................................. ±1A
Output Energy (Capacitive Load) ................................................................................. 5µJ
Analog Inputs (V
FB & ISENSE) ........................................................................ -0.3V to +6.3V
Error Amp Output Sink Current ............................................................................... 10mA
Power Dissipation at T
A = 25°C (M Package) .............................................................. 1W
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
PACKAGE PIN OUTS
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
1
8
27
36
45
M & Y PACKAGE
(Top View)
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
95°C/W
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
165°C/W
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
120°C/W
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
130°C/W
Junction Temperature Calculation:
T
J = TA + (PD x θJA).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
THERMAL DATA
DM PACKAGE
(Top View)
V
REF
V
CC
OUTPUT
GND
COMP
V
FB
I
SENSE
R
T/CT
1
8
27
36
45
V
REF
N.C.
V
CC
V
C
OUTPUT
GND
PWR GND
COMP
N.C.
V
FB
N.C.
I
SENSE
N.C.
R
T/CT
1
14
213
312
411
510
69
78
D PACKAGE
(Top View)
COMP
V
FB
I
SENSE
R
T/CT
V
REF
V
CC
OUTPUT
GND
Peak Package Solder Reflow Temp. (40 second max. exposure)..........................................260°C (+0, -5)
RoHS / Pb-free 100% Matte Tin Lead Finish


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