Moteur de recherche de fiches techniques de composants électroniques |
|
QXX04L4 Fiches technique(PDF) 6 Page - Littelfuse |
|
QXX04L4 Fiches technique(HTML) 6 Page - Littelfuse |
6 / 10 page 56 Revised: July 29, 2010 09:54 AM ©2010 Littelfuse, Inc Teccor® brand Thyristors Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 4 Amp Sensitive & Standard Triacs Lxx04xx & Qxx04xx Series Soldering Parameters Reflow Condition Pre Heat - Temperature Min (T s(min)) 150°C - Temperature Max (T s(max)) 200°C - Time (min to max) (t s) Average ramp up rate (Liquidus Temp) (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (T L) (Liquidus) 217°C - Temperature (t L) Peak Temperature (T P) 260°C +0/-5 Time within 5°C of actual peak Temperature (t p) Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (T P) 8 minutes Max. Do not exceed 280°C Environmental Specifications Test Specifications and Conditions AC Blocking MIL-STD-750, M-1040, Cond A Applied Peak AC voltage @ 125°C for 1008 hours Temperature Cycling MIL-STD-750, M-1051, 100 cycles; -40°C to +150°C; 15-min dwell time Temperature/ Humidity 1008 hours; 320V - DC: 85°C; 85% rel humidity High Temp Storage MIL-STD-750, M-1031, 1008 hours; 150°C Low-Temp Storage 1008 hours; -40°C Thermal Shock MIL-STD-750, M-1056 10 cycles; 0°C to 100°C; 5-min dwell time at each temperature; 10 sec (max) transfer time between temperature Autoclave 168 hours (121°C at 2 ATMs) and 100% R/H Resistance to Solder Heat MIL-STD-750 Method 2031 Solderability ANSI/J-STD-002, category 3, Test A Lead Bend Physical Specifications Terminal Finish 100% Matte Tin-plated Body Material UL recognized epoxy meeting flammability Terminal Material Copper Alloy Design Considerations Careful selection of the correct device for the application’s operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Good design practice should limit the maximum continuous current through the main terminals to 75% of the device rating. Other ways to ensure long life for a power discrete semiconductor are proper heat sinking and selection of voltage ratings for worst case conditions. Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do |
Numéro de pièce similaire - QXX04L4 |
|
Description similaire - QXX04L4 |
|
|
Lien URL |
Politique de confidentialité |
ALLDATASHEET.FR |
ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |