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FAN5362UC27X Fiches technique(PDF) 3 Page - Fairchild Semiconductor |
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FAN5362UC27X Fiches technique(HTML) 3 Page - Fairchild Semiconductor |
3 / 14 page © 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5362 • Rev. 1.0.1 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN Input Voltage –0.3 6.5 V VSW Voltage on SW Pin –0.3 VIN + 0.3 (3) V VCTRL EN and MODE Pin Voltage –0.3 VIN + 0.3 (3) V VFB FB Pin –0.3 4 V ESD Electrostatic Discharge Protection Level Human Body Model per JESD22-A114 3.0 kV Charged Device Model per JESD22-C101 1.5 TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 3. Lesser of 6.5V or VIN+0.3V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Min. Typ. Max. Unit VCC Supply Voltage Range 2.7 (4) 5.5 V IOUT Output Current for 2.1V 0 750 mA Output Current for 2.5V, 2.7V, 2.9V, 3.3V 0 500 L Inductor 1 µH CIN Input Capacitor 2.2 µF COUT Output Capacitor 10 24 µF TA Operating Ambient Temperature –40 +85 °C TJ Operating Junction Temperature –40 +125 °C Note: 4. Minimum VIN = VOUT + 200mV or 2.7V, whichever is greater. Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 1s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperature TA. Symbol Parameter Typical Unit θJA Junction-to-Ambient Thermal Resistance WLSCP 150 °C/W UMLP 49 |
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