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FAN5358 Fiches technique(PDF) 3 Page - Fairchild Semiconductor

No de pièce FAN5358
Description  2MHz, 500mA, SC70 Synchronous Buck Regulator
Download  13 Pages
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Fabricant  FAIRCHILD [Fairchild Semiconductor]
Site Internet  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN5358 Fiches technique(HTML) 3 Page - Fairchild Semiconductor

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© 2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5358 • Rev. 1.0.2
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
Parameter
Min.
Max.
Units
VIN
Input Voltage with Respect to GND
-0.3
6.0
V
Voltage on Any Other Pin with Respect to GND
-0.3
VIN +0.3V
(2)
V
TJ
Junction Temperature
-40
+150
°C
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Temperature (Soldering 10 Seconds)
+260
°C
ESD
Electrostatic Discharge Protection Level
Human Body Model,
JESD22-A114
2
kV
Charged Device Model,
JESD22-C101
1
Note:
2.
Lesser of 6.0V or VIN + 0.3V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Typ.
Max.
Units
VCC
Supply Voltage Range
2.7
5.5
V
IOUT
Output Current
0
500
mA
L
Inductor
2.2
µH
CIN
Input Capacitor
2.2
µF
COUT
Output Capacitor
(3)
4.7
µF
TA
Operating Ambient Temperature
–40
+85
°C
TJ
Operating Junction Temperature
–40
+125
°C
Thermal Properties
Symbol
Parameter
Min.
Typ.
Max.
Units
ΘJA
Junction-to-Ambient Thermal Resistance
(4)
285
°C/W
Notes:
3.
Refer to Operation Description section for guidance on maximum COUT capabilities.
4.
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed junction
temperature TJ(max) at a given ambient temperate TA.


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