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ISL55210IRTZ-EVALZ Fiches technique(PDF) 2 Page - Intersil Corporation |
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ISL55210IRTZ-EVALZ Fiches technique(HTML) 2 Page - Intersil Corporation |
2 / 18 page ISL55210 2 FN7811.0 March 2, 2011 Pin Configuration ISL55210 (3x3 16 LD TQFN) TOP VIEW GND NC NC GND GND VCM FB+ VS+ 1 2 3 4 56 78 9 10 11 12 13 14 15 16 + - VCM Vi- GND GND Vi+ FB- VO+ VO- VS+ PD Pin Descriptions PIN NUMBER SYMBOL DESCRIPTION 1 FB+ Positive Output Feedback resistor connection 2Vi- Inverting Amplifier Input 3Vi+ Noninverting Amplifier Input 4 FB- Negative Output Feedback resistor connection 5, 8, 13, 16 GND Supply Ground (Thermal Pad Electrically Connected) 6, 15 VS+ Positive power supply (3.0V~4.5V) 7PD Power-down: PD = logic low puts part into low power mode, PD = logic high or 1kΩ to VS+ for normal operation 9VO- Inverting Amplifier Output 10, 11 NC No Internal Connection 12 VO+ Noninverting Amplifier Output 14 VCM Common-mode Voltage Input Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP RANGE (°C) PACKAGE (Pb-free) TRANSPORT MEDIA, QUANTITY PKG. DWG. # ISL55210IRTZ 5210 -40 to +85 16 Ld 3x3 TQFN L16.3x3D ISL55210IRTZ-T7 5210 -40 to +85 16 Ld 3x3 TQFN Tape and Reel, 1000 L16.3x3D ISL55210IRTZ-T7A 5210 -40 to +85 16 Ld 3x3 TQFN Tape and Reel, 250 L16.3x3D ISL55210IRTZ-EVALZ Evaluation Board (Contact local sales) NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb- free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL55210. For more information on MSL please see techbrief TB363. |
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