LC86P5632

No.6688-11/23

1. Absolute Maximum Ratings at VSS=0V and Ta=25

°C

Ratings

Parameter

Symbol

Pins

Conditions

VDD[V]

min.

typ.

max.

unit

Supply voltage

VDDMAX VDD,VDDVPP

VDD=VDDVPP

-0.3

+7.0

Input voltage

VI(1)

•Port 8

-0.3

VDD+0.3

VIO(1)

•Ports 0,1,2

•Ports 3,4,5 at CMOS

output

-0.3

VDD+0.3

Input/Output

voltage

VIO(2)

Ports 3,4,5 at N-ch open

drain output option

-0.3

15

V

Peak

output

current

IOPH(1)

•Ports 0,1,2,3,4,5

•CMOS output

•At each pins

-4

ΣIOAH(1) Ports 0,1,2

The total of all pins

-25

High

level

output

current

Total

output

current

ΣIOAH(2) Ports 3,4,5

The total of all pins

-20

IOPL(1)

Ports 0,1,2,3,4,5

At each pins

20

Peak

output

current

IOPL(2)

Port 70

At each pins

15

ΣIOAL(1) Ports 0,1,70

The total of all pins

40

ΣIOAL(2) Port 2

The total of all pins

40

Low

level

output

current

Total

output

current

ΣIOAL(3) Ports 3,4,5

The total of all pins

80

mA

Pdmax(1)

DIP64S

Ta=-30 to+70°C

720

Maximum power

dissipation

Pdmax(2)

QFP64E

Ta=-30 to+70°C

420

mW

Operating

temperature

range

Topr

-30

70

Storage

temperature

range

Tstg

-65

150

°C

Notes

• The QFP packages should be heat-soaked for 12 hours at 125

°C immediately prior to mounting (This baking is called

pre-baking).

• After pre-baking, a controlled environment must be maintained until soldering. The environment must be held at a

temperature of 30

°C or less and a humidity level of 70% or less. Please solder within 24 hours.