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BC847PN-7-F Fiches technique(PDF) 1 Page - Diodes Incorporated |
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BC847PN-7-F Fiches technique(HTML) 1 Page - Diodes Incorporated |
1 / 4 page BC847PN Document number: DS30278 Rev. 12 - 2 1 of 4 www.diodes.com November 2008 © Diodes Incorporated BC847PN COMPLEMENTARY PAIR SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features • Epitaxial Die Construction • Two Internally Isolated NPN/PNP Transistors in one package • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (Note 2) • Qualified to AEC-Q101 Standards for High Reliability • "Green" Device (Notes 3 and 4) Mechanical Data • Case: SOT-363 • Case Material: Molded Plastic, “Green” Molding Compound, Note 4. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating) Solderable per MIL-STD-202, Method 208 • Terminal Connections: See Diagram • Marking Information: See Page 4 • Ordering Information: See Page 4 • Weight: 0.006 grams (approximate) Maximum Ratings, NPN Section @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Collector-Base Voltage VCBO 50 V Collector-Emitter Voltage VCEO 45 V Emitter-Base Voltage VEBO 6.0 V Collector Current IC 100 mA Peak Collector Current ICM 200 mA Peak Emitter Current IEM 200 mA Maximum Ratings, PNP Section @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Collector-Base Voltage VCBO -50 V Collector-Emitter Voltage VCEO -45 V Emitter-Base Voltage VEBO -5.0 V Collector Current IC -100 mA Peak Collector Current ICM -200 mA Peak Emitter Current IEM -200 mA Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 1) @ TA = 25°C Total Device PD 200 mW Thermal Resistance, Junction to Ambient (Note 1) @ TA = 25°C RθJA 625 °C/W Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. No purposefully added lead. 3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants Top View Device Schematic C 1 B 2 E 2 E 1 B 1 C 2 |
Numéro de pièce similaire - BC847PN-7-F |
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Description similaire - BC847PN-7-F |
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