Philips Semiconductors

Product specification

TOPFET high side switch

BUK209-50Y

MECHANICAL DATA

Fig.4. SOT263B package

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT263B-01

5-lead (option)

TO-220

D

D1

q

L

15

L3

mounting

base

L4

m

e

Q

b

0

5

10 mm

scale

Plastic single-ended package; heatsink mounted; 1 mounting hole;

5-lead TO-220 lead form option

SOT263B-01

UNIT

A1

D1

eL

∅ p

mm

1.7

L1

L2

q

3.0

2.7

4.5

4.1

1.39

1.27

0.85

0.70

0.7

0.4

15.8

15.2

6.4

5.9

10.3

9.7

9.8

9.7

5.9

5.3

5.2

5.0

2.4

1.6

0.8

0.6

3.8

3.6

p1

4.3

4.1

Q1

Q

2.0

4.5

Q2

8.2

R

0.5

w

0.4

DIMENSIONS (mm are the original dimensions)

A

b

D

c

0.5

L3

(1)

L4

(2)

max.

E

m

A

A1

c

Q1

Q2

Notes

1. Terminal dimensions are uncontrolled in this zone.

2. Positional accuracy of the terminals is controlled in this zone.

L1

L2

R

R

01-01-11

∅ p

p1

E

1 Refer to mounting instructions for TO220 envelopes. Epoxy meets UL94 VO at 1/8". Net mass: 2 g

September 2002

7

Rev 2.000