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ISL21032 Fiches technique(PDF) 2 Page - Intersil Corporation

No de pièce ISL21032
Description  Precision 0.600V Low Voltage FGA References
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Fabricant  INTERSIL [Intersil Corporation]
Site Internet  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL21032 Fiches technique(HTML) 2 Page - Intersil Corporation

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2
FN6239.2
September 28, 2009
Absolute Maximum Ratings
Thermal Information
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V
Max Voltage VOUT to GND (Note 1)
ISL21032, VOUT = 0.6V . . . . . . . . . . . . . . . . . . . . . -0.5V to +1.6V
Voltage on “DNC” Pins. . . No Connections Permitted to These Pins.
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Thermal Resistance (Typical, Note 2)
θJA (°C/W)
3 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . .
371.4
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-Free Reflow Profile (Note 3). . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
For guaranteed specifications and test conditions, see Electrical Specifications.
The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed
test conditions.
NOTES:
1. Maximum duration = 10s.
2.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. Post-reflow drift for the ISL21032 devices will range from 100µV to 1.0mV based on experimental results with devices tested in sockets and also
on FR4 multi-layer PC boards. The design engineer must take this into account when considering the reference voltage after assembly.
Electrical Specifications (VOUT = 0.600V) Operating Conditions: VIN = 3.0V, IOUT = 0mA, COUT = 0.001µF, TA = -40 to +130°C,
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VOUT
Output Voltage
0.600
V
VOA
VOUT Accuracy @ TA = +25°C
ISL21032B06
-1.0
+1.0
mV
ISL21032C06
-2.5
+2.5
mV
ISL21032D06
-5.0
+5.0
mV
VOA
VOUT Accuracy Over Op Temp
Range (-40° < TA < +130°C)
ISL21032B06
-3.0
+3.0
mV
ISL21032C06
-4.5
+4.5
mV
ISL21032D06
-6.0
+6.0
mV
VIN
Input Voltage Range
2.7
5.5
V
IIN
Supply Current
12
25
µA
ΔVOUT/ΔVIN
Line Regulation
+2.7V
≤ VIN ≤ +5.5V
50
200
µV/V
ΔVOUT/ΔIOUT
Load Regulation
Sourcing: 0mA
≤ ISOURCE ≤ 7mA
20
70
µV/mA
Sinking: -7mA
≤ I
SINK ≤ 0mA
20
70
µV/mA
ΔVOUT/Δt
Long Term Stability (Note 6)
TA = +25°C
10
ppm/
1kHrs
ΔV
OUT/ΔTA
Thermal Hysteresis (Note 4)
ΔT
A = +170°C
100
ppm
ISC
Short Circuit Current (Note 5)
TA = +25°C, VOUT tied to GND
50
80
mA
VN
Output Voltage Noise
0.1Hz
≤ f ≤ 10Hz
30
µVP-P
NOTES:
4. Thermal Hysteresis is the change in VOUT measured @ TA = +25°C after temperature cycling over a specified range, ΔTA.
VOUT is read initially at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at
+25°C. The difference between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For ΔTA = 170°C, the device
under is cycled from +25°C to +130°C to -40°C to +25°C.
5. Limits are established by full device characterization over temperature range and are not tested in production.
6. FGA™ voltage reference long term drift is a logarithmic characteristic. Changes that occur after the first few hundred hours of operation are
significantly smaller with time, asymptotically approaching zero beyond 2000 hours. Because of this decreasing characteristic, long-term drift is
specified in ppm/
√1kHr.
ISL21032


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