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TLC5960DA Fiches technique(PDF) 2 Page - Texas Instruments |
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TLC5960DA Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 33 page TLC5960 SBVS147 – SEPTEMBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR ORDERING NUMBER TLC5960 TSSOP-38 DA TLC5960DA (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). VALUE MIN MAX UNIT VIN, CTRL2, CTRL4 –0.3 30 V S1 to S8, D1 to D8 –0.3 38 V Voltage(2) EN, CTRL1, CTRL3, VADJ, VREG5, G1 to G8, XFLT, HVM1 to –0.3 6.0 V HVM4 Operating virtual junction, TJ –40 +150 °C Temperature Storage, Tstg –55 +150 °C Human Body Model (HBM, JESD22-A114) 2 kV Electrostatic Discharge Rating(3) Charged Device Model (CDM. JESD22-C101) 1000 V Machine Model (MM) 200 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground terminal. (3) ESD testing is performed according to the respective JESD22 JEDEC standard. THERMAL INFORMATION TLC5960 THERMAL METRIC(1) DA UNITS 38 PINS qJA Junction-to-ambient thermal resistance 71.2 qJCtop Junction-to-case (top) thermal resistance 21.8 qJB Junction-to-board thermal resistance 43.6 °C/W yJT Junction-to-top characterization parameter 0.5 yJB Junction-to-board characterization parameter 38.7 qJCbot Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. DISSIPATION RATINGS OPERATING FACTOR TA < +25°C TA = +70°C TA = +85°C PACKAGE ABOVE TA = +25°C POWER RATING POWER RATING POWER RATING TSSOP-38 (DA) 14mW/°C 1404mW 770mW 560mW 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5960 |
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