NCV8665 datasheet(2/11 Pages) ONSEMI

No de pièce	NCV8665

Description	150 mA Very Low Iq Low Dropout Linear Regulator with Reset and Delay Reset

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Fabricant	ONSEMI [ON Semiconductor]

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NCV8665

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PIN DESCRIPTIONS

Symbol

Function

VIN

Unregulated input voltage; 5.5 V to 45 V; Battery Input Voltage. Bypass to GND with a 0.1 mF ceramic capacitor.

RO

Reset Output; open collector active Reset (Accurate when VOUT > 1.0 V)

GND

Ground; Pin 3 internally connected to Tab

D

Reset Delay; timing capacitor to GND for Reset Delay function

VOUT

Output; ±2.0%, 150 mA. 10 mF, ESR < 16 W

ABSOLUTE MAXIMUM RATINGS

Pin Symbol, Parameter

Symbol

Min

Max

Unit

VIN, DC Input Voltage

VIN

−42

+45

V

VOUT, DC Voltage

VOUT

−0.3

+16

V

Reset Output Voltage

VRO

−0.3

25

V

Reset Output Current

IRO

−5.0

5.0

mA

Reset Delay Voltage

VD

−0.3

7.0

V

Reset Delay Current

ID

−2.0

2.0

mA

Storage Temperature

TSTG

−55

+150

°C

ESD Capability, Human body Model (Note 1)

VESDHB

4000

V

ESD Capability, Machine Model (Note 1)

VESDMM

200

V

Moisture Sensitivity Level

MSL

1

−

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model (HBM) tested per AEC−Q100−002 (EIA/JESD22−A 114C)

ESD Machine Model (MM) tested per AEC−Q100−003 (EIA/JESD22−A 115C)

2. Latchup Current Maximum Rating: ≤ 100 mA per JEDEC standard: JESD78.

OPERATING RANGE

Pin Symbol, Parameter

Symbol

Min

Max

Unit

Input Voltage Operating Range

VIN

5.5

45

V

Junction Temperature

TJ

−40

150

°C

THERMAL RESISTANCE

Parameter

Symbol

Min

Max

Unit

Junction to Ambient (Note 3)

D2PAK

RqJA

−

85.4

°C/W

Junction to Case (Note 3)

D2PAK

RqJC

−

6.8

Junction to Ambient (Note 4)

SOIC−8

RqJA

−

138

Junction to Lead 6 (Note 4)

SOIC−8

YqJL6

−

21

3. As mounted on a 35x35x1mm FR4 PCB with a single layer of 100 mm2 of 1 oz copper heat spreading area.

4. As mounted on a 35x35x1mm FR4 PCB with a single layer of 100 mm2 of 1 oz copper heat spreading area including traces directly connected

to the leads.

Pb SOLDERING TEMPERATURE AND MSL

Parameter

Symbol

Min

Max

Unit

Lead Temperature Soldering Reflow (SMD styles only), Pb−Free (Note 5)

Tsld

−

265 pk

°C

MSL, 8−Lead EP, LS Temperature 260°C

MSL

1

−

5. This device series incorporates ESD protection and exceeds the following ratings:

Human Body Model (HBM) v 2.0 kV per JEDEC standard: JESD22–A114.

Machine Model (MM) v 200 V per JEDEC standard: JESD22–A115.

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