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FEATURES

3

2

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1B

GND

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1

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CC

V

CC

2B

1Y

1Y

1Y

1B

GND

1B

GND

2A

2Y

Seemechanicaldrawingsfordimensions.

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2Y

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CC

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DCTPACKAGE

(TOP VIEW)

DCUPACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOMVIEW)

A

DESCRIPTION/ORDERING INFORMATION

SN74AUC2G86

DUAL 2-INPUT EXCLUSIVE-OR GATE

SCES479B – AUGUST 2003 – REVISED JANUARY 2007

• Available in the Texas Instruments

• Low Power Consumption, 10-µA Max I

CC

NanoFree™ Package

• ±8-mA Output Drive at 1.8 V

• Optimized for 1.8-V Operation and Is 3.6-V I/O

• Latch-Up Performance Exceeds 100 mA Per

Tolerant to Support Mixed-Mode Signal

JESD 78, Class II

Operation

• ESD Protection Exceeds JESD 22

• I

–

2000-V Human-Body Model (A114-A)

Operation

–

200-V Machine Model (A115-A)

• Sub-1-V Operable

–

1000-V Charged-Device Model (C101)

• Max t

The SN74AUC2G86 performs the Boolean function Y = A

⊕ B or Y = AB + AB in positive logic.

A common application is as a true/complement element. If the input is low, the other input is reproduced in true

form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

Reel of 3000

SN74AUC2G86YZPR

_ _ _UH_

0.23-mm Large Bump – YZP (Pb-free)

–40

°C to 85°C

SSOP – DCT

Reel of 3000

SN74AUC2G86DCTR

U86_ _ _

VSSOP – DCU

Reel of 3000

SN74AUC2G86DCUR

U86_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 2003–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.