Bump View

1

2

B

C

D

A

Laser Marking View

2

1

B

C

D

A

EN2

1

8

Exposed

Thermal

Die Pad

on

Underside

3

6

GND

2

7

EN1

OC

4

5

TPS22949

TPS22949A

SLVS908C – FEBRUARY 2009 – REVISED JANUARY 2010

www.ti.com

ORDERABLE PART NUMBER

SON – DRG

Tape and reel

TPS22949ADRGR

ZUG

–40°C to 85°C

TPS22949YZPR

_ _ _4Y_

WCSP – YZP

Tape and reel

TPS22949AYZPR

_ _ _4Z_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

YZP PACKAGE

Table 1. YZP PACKAGE TERMINAL

ASSIGNMENTS

D

EN1

OC

C

B

GND

A

EN2

2

1

DRG PACKAGE

(TOP VIEW)

The exposed center pad, if used, must be connected as a secondary GND or left electrically open.

TERMINAL FUNCTIONS

TERMINAL

NO.

DESCRIPTION

NAME

YZP

DRG

A1

8

Supply voltage

A2

1

EN2

LDO control input. Active high. Do not leave floating.

B1

7

B2

2

GND

Ground

C1

6

Switch output. Output of the power switch

C2

3

Supply input. Input to the power switch; bypass this input with a ceramic capacitor to ground.

Over current output flag. Active low, open-drain output that indicates an over-current, supply

D1

5

OC

undervoltage, or over-temperature state.

D2

4

EN1

Power switch control input. Active high. Do not leave floating.

(1)

Output voltages from 0.9 V to 3.6 V in 50-mV increments are available through the use of innovative factory EEPROM programming;

minimum order quantities may apply. Contact factory for details and availability.

2

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