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PZU11B2L Fiches technique(PDF) 4 Page - NXP Semiconductors

No de pièce PZU11B2L
Description  Single Zener diodes
Download  13 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

PZU11B2L Fiches technique(HTML) 4 Page - NXP Semiconductors

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PZUXBL_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 6 May 2008
4 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
6.
Thermal characteristics
[1]
Reflow soldering is the only recommended soldering method.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4]
Soldering point of cathode tab.
7.
Characteristics
[1]
Pulse test: tp ≤ 300 µs; δ≤ 0.02.
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1][2] -
-
500
K/W
[1][3] -
-
250
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[4] --55
K/W
Table 7.
Characteristics
Tj =25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
forward voltage
[1]
IF = 10 mA
-
-
0.9
V
IF = 100 mA
-
-
1.1
V
Table 8.
Characteristics per type; PZU2.4BL to PZU5.6B2L
Tj =25 °C unless otherwise specified.
PZUxxx Sel
Working
voltage
VZ (V)
Differential resistance
rdif (Ω)
Reverse
current
IR (µA)
Temperature
coefficient
SZ (mV/K)
Diode
capacitance
Cd (pF)[1]
Non-repetitive
peak reverse
current
IZSM (A)[2]
IZ =5mA
IZ = 0.5 mA IZ =5mA
IZ =5mA
Min
Max
Max
Max
Max
VR (V)
Typ
Max
Max
2.4
B
2.3
2.6
1000
100
50
1
−1.6
450
8
2.7
B
2.5
2.9
1000
100
20
1
−2.0
440
8
B2
2.65
2.9
3.0
B
2.80
3.20
1000
95
10
1
−2.1
425
8
B2
2.95
3.20
3.3
B
3.10
3.50
1000
95
5
1
−2.4
410
8
B2
3.25
3.50
3.6
B
3.40
3.80
1000
90
5
1
−2.4
390
8
B2
3.55
3.80
3.9
B
3.70
4.10
1000
90
3
1
−2.5
370
8
B2
3.87
4.10
4.3
B
4.01
4.48
1000
90
3
1
−2.5
350
8
B2
4.15
4.34


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