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74CBTLV1G125GM Fiches technique(PDF) 2 Page - NXP Semiconductors |
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74CBTLV1G125GM Fiches technique(HTML) 2 Page - NXP Semiconductors |
2 / 18 page 74CBTLV1G125_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 23 February 2007 2 of 18 NXP Semiconductors 74CBTLV1G125 Single bus switch 3. Ordering information 4. Marking 5. Functional diagram Table 1. Ordering information Type number Package Temperature range Name Description Version 74CBTLV1G125GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74CBTLV1G125GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 74CBTLV1G125GM −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1.45 × 0.5 mm SOT886 74CBTLV1G125GF −40 °C to +125 °C XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1 × 0.5 mm SOT891 Table 2. Marking Type number Marking code 74CBTLV1G125GW bM 74CBTLV1G125GV b25 74CBTLV1G125GM bM 74CBTLV1G125GF bM Fig 1. Logic symbol Fig 2. Logic diagram 001aad713 A OE B 4 2 1 SWITCH 001aad714 AB OE |
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