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LA262B-G-PF Fiches technique(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA262B-G-PF Fiches technique(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 6 page Page 5/5 Reference Standard Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Operating Life Test Test Item Reliability Test: 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. Low Temperature Storage Test Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 JIS C 7021: B-12 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test intended to see soldering well performed or not. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA262B/G-PF |
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