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TPS22907YZTT Fiches technique(PDF) 1 Page - Texas Instruments |
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TPS22907YZTT Fiches technique(HTML) 1 Page - Texas Instruments |
1 / 14 page Laser Marking View Bump View B 2 1 A B 1 2 A TPS22907 www.ti.com SLVSA44 – NOVEMBER 2009 ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH Check for Samples: TPS22907 1 FEATURES APPLICATIONS • Battery Powered Equipment • Low Input Voltage: 1.1 V to 3.6 V • Portable Industrial Equipment • Ultra-Low ON-State Resistance • Portable Medical Equipment – rON = 44 mΩ at VIN = 3.6 V • Portable Media Players – rON = 50 mΩ at VIN = 2.5 V • Point Of Sales Terminal – rON = 58 mΩ at VIN = 1.8 V • GPS Devices – rON = 83 mΩ at VIN = 1.2 V • Digital Cameras • 1-A Maximum Continuous Switch Current • Portable Instrumentation • Quiescent Current < 1 µA • Smartphones • Shutdown Current < 1 µA YZT PACKAGE • Low Control Input Thresholds Enable Use of Low-Voltage Logic • Controlled Slew Rate to Avoid Inrush Currents • ESD Performance Tested Per JESD 22 – 3000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Table 1. TERMINAL ASSIGNMENTS • Ultra Small Four-Terminal Wafer Chip Scale B ON GND Package (WCSP) A VIN VOUT – 0.9 mm × 0.9 mm, 2 1 0.5-mm Pitch, 0.5-mm Height DESCRIPTION The TPS22907 is an ultra small, low RON load switch with controlled turn on. The device contains a P-channel MOSFET that operates over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. The TPS22907 is available in a space-saving 4-terminal WCSP with 0.5-mm pitch (YZT). The device is characterized for operation over the free-air temperature range of –40°C to 85°C. rON SLEW RATE MAXIMUM OUTPUT DEVICE ENABLE (TYP at 1.8 V) (TYP at 1.8 V) CURRENT TPS22907 58 m Ω 36 μs 1000 mA Active high ORDERING INFORMATION TA PACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°C WCSP – YZT (0.5-mm pitch) Tape and reel TPS22907YZTR _ _ _ 5K_(3) (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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