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AT45DB321D-TU Fiches technique(PDF) 52 Page - ATMEL Corporation |
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AT45DB321D-TU Fiches technique(HTML) 52 Page - ATMEL Corporation |
52 / 57 page 52 3597N–DFLASH–04/09 AT45DB321D 27.3 8S2 – EIAJ SOIC TITLE DRAWING NO. GPC REV. Package Drawing Contact: packagedrawings@atmel.com 8S2 STN F 8S2, 8-lead, 0.208” Body, Plastic Small Outline Package (EIAJ) 4/15/08 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. 2. Mismatch of the upper and lower dies and resin burrs aren't included. 3. Determines the true geometric position. 4. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm. A 1.70 2.16 A1 0.05 0.25 b 0.35 0.48 4 C 0.15 0.35 4 D 5.13 5.35 E1 5.18 5.40 2 E 7.70 8.26 L 0.51 0.85 θ 0° 8° e 1.27 BSC 3 θθ 1 1 N N E E TOP VIEW TOP VIEW C C E1 E1 END VIEW END VIEW A A b b L L A1 A1 e e D D SIDE VIEW SIDE VIEW |
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