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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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SMB239 Fiches technique(PDF) 6 Page - Summit Microelectronics, Inc. |
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SMB239 Fiches technique(HTML) 6 Page - Summit Microelectronics, Inc. |
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6 / 30 page  SMB239 Summit Microelectronics, Inc 2129 3.0 2/23/2009 6 RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS Temperature Under Bias ....................... -55°C to 155°C Storage Temperature............................. -55°C to 125°C Terminal Voltage with Respect to GND: VIN ................................................... -0.3V to +10V All Others ..............................................-0.3V to 6V Output Short Circuit Current ............................... 100mA Lead Solder Temperature (10 s)...........................300°C Junction Temperature.......................…….....…...150°C HBM ESD Rating per JEDEC…………………..…4000V MM ESD Rating per JEDEC………………….….…200V CDM ESD Rating per JEDEC……………………..1000V Latch-Up testing per JEDEC………..…....…… ±100mA Note: The device is not guaranteed to function outside its operating rating. Stresses listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions outside those listed in the operational sections of the specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability. Devices are ESD sensitive. Handling precautions are recommended. Industrial Temperature Range ……… …-30°C to +85°C VIN ..........................................................+4.35V to +6.5V Package Thermal Resistance ( θJA) uCSP TM-8…………………………..………..….…68°C/W Note: measured on a 2” x 2”, 4-layer PCB with a copper weight of 1oz for each of the top, PWR, GND, and bottom layer. RELIABILITY CHARACTERISTICS Data Retention…………………………..…..100 Years Endurance…………………….……….100,000 Cycles DC OPERATING CHARACTERISTICS TA= -30°C to +85°C, VIN = +5.0V, VFLOAT = +4.2V unless otherwise noted. All voltages are relative to GND. Symbol Parameter Conditions Min Typ Max Unit General VIN Input supply voltage VFLT = 4.2V +4.35 +6.5 V VUVLO Under-voltage lockout voltage VFLT = 4.2V +3.5 V VUVLO-HYS Under-voltage lockout hysteresis VFLT = 4.2V 10 mV VOVLO Input over-voltage lockout voltage +7.0 V VVOB Battery over-voltage lockout voltage VFLT+0.1 V VASHDN Automatic shutdown threshold voltage VIN – VBATT 130 mV IIN-ACTIVE Active supply current 0.7 mA IIN-DISABLE Disable supply current Input voltage present 0.7 mA ILK Reverse leakage current VIN < VBATT, T=0 oC to +70oC 2 µA TREG Thermal regulation temperature 110 oC |
Numéro de pièce similaire - SMB239 |
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Description similaire - SMB239 |
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