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934057053135 Fiches technique(PDF) 5 Page - NXP Semiconductors |
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934057053135 Fiches technique(HTML) 5 Page - NXP Semiconductors |
5 / 12 page Z0103MN_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 5 August 2009 5 of 12 NXP Semiconductors Z0103MN Logic level four-quadrant triac 5. Thermal characteristics Fig 4. Maximum permissible RMS on-state current as a function of solder point temperature; typical values. 003aad391 0 0.4 0.8 1.2 −50 0 50 100 150 Tsp ( °C) IT(RMS) (A) Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point see Figure 5 --25 K/W Rth(j-a) thermal resistance from junction to ambient - 150 - K/W -60 - K/W Fig 5. Transient thermal impedance from junction to solder point as a function of pulse duration 003aad390 10− 2 10− 1 1 10 10 2 10− 5 10− 4 10− 3 10− 2 1 10 tp (s) Zth(j-sp) (K/W) tp P t 10− 1 |
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