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TPS2205 Fiches technique(PDF) 3 Page - Texas Instruments |
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TPS2205 Fiches technique(HTML) 3 Page - Texas Instruments |
3 / 28 page TPS2205 DUAL-SLOT PC CARD POWER-INTERFACE SWITCH FOR PARALLEL PCMCIA CONTROLLERS SLVS128D OCTOBER 1995 – REVISED JUNE 1998 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPS2205Y chip information This chip, when properly assembled, displays characteristics similar to those of the TPS2205. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. 43 2 1 27 26 25 24 23 22 21 20 19 18 17 16 14 15 13 12 11 10 9 8 7 6 5 BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJ max = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. 142 144 TPS2205Y 1 2 3 4 5 6 7 8 9 10 11 12 13 14 27 26 25 24 23 22 21 20 19 18 17 16 15 5V 5V A_VPP_PGM A_VPP_VCC A_VCC5 A_VCC3 12V AVPP AVCC AVCC AVCC GND SHDN 3.3V 5V B_VPP_PGM B_VPP_VCC B_VCC5 B_VCC3 12V BVPP BVCC BVCC BVCC OC 3.3V 3.3V |
Numéro de pièce similaire - TPS2205 |
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Description similaire - TPS2205 |
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