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AME1300HEQA270Z Fiches technique(PDF) 11 Page - Analog Microelectronics

No de pièce AME1300HEQA270Z
Description  300mA CMOS LDO with RESET Function
Download  12 Pages
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Fabricant  AME [Analog Microelectronics]
Site Internet  http://www.ame.com.tw/
Logo AME - Analog Microelectronics

AME1300HEQA270Z Fiches technique(HTML) 11 Page - Analog Microelectronics

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AME
11
AME1300
300mA CMOS LDO with
RESET Function
Rev.C.02
MIN
MAX
MIN
MAX
A
-
1.07
-
0.04197
A1
0.05
0.20
0.002
0.008
A2
0.81
0.92
0.032
0.036
b
0.28
0.38
0.011
0.015
b1
0.28
0.33
0.011
0.013
c
0.13
0.23
0.005
0.009
c1
0.13
0.17
0.005
0.006
D
2.90
3.10
0.114
0.122
E
4.77
4.98
0.188
0.196
E1
2.90
3.10
0.114
0.122
e
e1
L
0.406
0.686
0.01598 0.02701
L1
L2
θ
0
o
8
o
0
o
8
o
SYMBOLS
MILLIMETERS
INCHES
0.65 TYP
0.0255 TYP
1.95 TYP
0.0767 TYP
0.94 REF
0.037 REF
0.010 TYP
0.254 TYP
n Package Dimension
MSOP-8
NOTE:
1. Controlling dimension : Millimeter, converted inchdimension
are not necessarily exact.
2. Dimensiioning and tolerancing per ansi Y14.5m-1994.
3. Dimension "d" does not include mold flash,protrusion or gate
burr, mold flash,protrusion and gate burr shall not exceed
0.15mm(0.006") per side. Dimension e1 do not include inter-lead
flash or protrusion, inter-lead flash and protrusion shall not ex-
ceed 0.15mm(0.006") per side.
4. The package top be smaller than the package bottom. Dimen-
sion d and e1 are determined at outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
5. Dimension 'b' does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm(0.0031) total in excess of
the "b" dimension at maximum material condition.
WITH PLATING
BASE METAL
e
R0.127(0 .005) TYP
ALL CORNER
& EDGES
TOP PKG.
Top View
Front View
End View
E
E1
PIN 1 I.D
(SHINNY SURFACE)
D
e1
BTM PKG.
L
L1
L2
DETAIL A
b
A1
A2
A
b
b1
c1
c
B
SECTION B-B
E1
B
See Detail A
θ


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