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SBW-5089Z Fiches technique(PDF) 6 Page - SIRENZA MICRODEVICES |
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SBW-5089Z Fiches technique(HTML) 6 Page - SIRENZA MICRODEVICES |
6 / 6 page SBW-5089 DC-8.0 GHz Cascadeable MMIC Amplifier EDS-103325 Rev. C 6 Phone: (800) SMI-MMIC http://www.sirenza.com 303 South Technology Court Broomfield, CO 80021 SOT-89 PCB Pad Layout Dimensions in inches [millimeters] SOT-89 Nominal Package Dimensions Dimensions in inches [millimeters] A link to the SOT-89 package outline drawing with full dimensions and tolerances may be found on the product web page at www.sirenza.com. RF OUT RF I N Notes: 1 Solder the copper pad on the backside of the device package to the ground plane. 2 Provide a large ground pad area under device pins 1, 2, 4, & 5 with many plated via holes as shown. 3 Dimensions given for 50 Ohm RF I/O lines are for 31 mil thick Getek. Scale accordingly for different board thicknesses and dielectric contants. 4. We recommend 1 or 2 ounce copper. Measurements for this data sheet were made on a 31 mil thick Getek with 1 ounce copper on both sides. |
Numéro de pièce similaire - SBW-5089Z |
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Description similaire - SBW-5089Z |
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