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AD9239 Fiches technique(PDF) 8 Page - Analog Devices |
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AD9239 Fiches technique(HTML) 8 Page - Analog Devices |
8 / 40 page AD9239 Rev. 0 | Page 8 of 40 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 5. Parameter Rating Electrical AVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +2.0 V AGND to DRGND −0.3 V to +0.3 V AVDD to DRVDD −2.0 V to +2.0 V DOUT ± x to DRGND −0.3 V to DRVDD + 0.3 V SDO, SDI/SDIO, CLK± , VIN ± x, VCMx, TEMPOUT, RBIAS to AGND −0.3 V to AVDD + 0.3 V SCLK, CSB, PGMx, RESET, PDWN to AGND −0.3 V to AVDD + 0.3 V Environmental Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 6. Thermal Resistance Package Type θJA θJB θJC Unit 72-Lead LFCSP (CP-72-3) 16.2 7.9 0.6 °C/W Typical θJA, θJB, and θJC values are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces and through holes, ground, and power planes reduces the θJA. ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
Numéro de pièce similaire - AD9239 |
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Description similaire - AD9239 |
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