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SI5509DC Fiches technique(PDF) 3 Page - Vishay Siliconix

No de pièce SI5509DC
Description  N- and P-Channel 20-V (D-S) MOSFET
Download  12 Pages
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Fabricant  VISHAY [Vishay Siliconix]
Site Internet  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

SI5509DC Fiches technique(HTML) 3 Page - Vishay Siliconix

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Si5509DC
Vishay Siliconix
New Product
Document Number: 73629
S–60417—Rev. A, 20-Mar-06
www.vishay.com
3
SPECIFICATIONS (TJ = 25 _C UNLESS OTHERWISE NOTED)
Parameter
Unit
Max
Typa
Min
Test Condition
Symbol
Dynamica
Turn On Delay Time
td( )
N-Ch
6
9
Turn-On Delay Time
td(on)
N Channel
NCh
P-Ch
8
12
Rise Time
t
N-Channel
VDD = 10 V, RL =2.5 W
N-Ch
95
143
Rise Time
tr
VDD = 10 V, RL =2.5 W
ID ^ 4.0 A, VGEN = 4.5 V, Rg = 1 W
NCh
P-Ch
75
113
ns
Turn Off Delay Time
td( ff)
g
P-Channel
N-Ch
12
18
ns
Turn-Off Delay Time
td(off)
P Channel
VDD = –10 V, RL = 3.2 W
ID ^ –314A VGEN = –45V Rg =1 W
NCh
P-Ch
25
38
Fall Time
tf
ID ^ –3.14 A, VGEN = –4.5 V, Rg = 1 W
N-Ch
6
9
Fall Time
tf
NCh
P-Ch
60
90
Drain-Source Body Diode Characteristics
Continuous Source Drain Diode Current
IS
TC = 25 _C
N-Ch
3.75
Continuous Source-Drain Diode Current
IS
TC = 25 _C
P-Ch
–3.75
A
Pulse Diode Forward Currenta
ISM
N-Ch
10
A
Pulse Diode Forward Currenta
ISM
P-Ch
–15
Body Diode Voltage
VSD
IS = 2.4 A, VGS = 0 V
N-Ch
0.8
1.2
V
Body Diode Voltage
VSD
IS = –1.5 A, VGS = 0 V
P-Ch
–0.8
–1.2
V
Body Diode Reverse Recovery Time
t
N-Ch
12
18
ns
Body Diode Reverse Recovery Time
trr
P-Ch
18
27
ns
Body Diode Reverse Recovery Charge
Q
N-Channel
N-Ch
5
8
nC
Body Diode Reverse Recovery Charge
Qrr
N-Channel
IF = 2.4 A, di/dt = 100 A/ms, TJ = 25 _C
P-Ch
8
12
nC
Reverse Recovery Fall Time
t
P-Channel
N-Ch
7.5
Reverse Recovery Fall Time
ta
P Channel
IF = –1.5 A, di/dt = –100 A/ms, TJ = 25 _C
P-Ch
14
ns
Reverse Recovery Rise Time
tb
N-Ch
4.5
ns
Reverse Recovery Rise Time
tb
P-Ch
4
Notes
a.
Guaranteed by design, not subject to production testing.
b.
Pulse test; pulse width
v 300 ms, duty cycle v 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.


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