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FAN2103 Fiches technique(PDF) 4 Page - Fairchild Semiconductor

No de pièce FAN2103
Description  TinyBuck??3A, 24V Input, Integrated Synchronous Buck Regulator
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Fabricant  FAIRCHILD [Fairchild Semiconductor]
Site Internet  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN2103 Fiches technique(HTML) 4 Page - Fairchild Semiconductor

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© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN2103 Rev. 1.0.5
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Parameter
Conditions
Min.
Max.
Unit
VIN to PGND
28
V
VCC to AGND
AGND = PGND
6
V
BOOT to PGND
35
V
BOOT to SW
-0.3
6.0
V
SW to PGND
Transient (t < 20ns, f < 600KHz)
-5
30
V
All other pins
-0.3
VCC+0.3
V
Human Body Model, JESD22-A114
2
ESD
Charged Device Model, JESD22-C101
2
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
VCC
Bias Voltage
VCC to AGND
4.5
5.0
5.5
V
VIN
Supply Voltage
VIN to PGND
3
24
V
FAN2103M
-10
+85
°C
TA
Ambient Temperature
FAN2103EM
-40
+85
°C
TJ
Junction Temperature
+125
°C
Thermal Information
Symbol
Parameter
Min.
Typ.
Max.
Unit
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+300
°C
TVP
Vapor Phase, 60 Seconds
+215
°C
TI
Infrared, 15 Seconds
+220
°C
P1 (Q2)
4
°C/W
P2 (Q1)
7
°C/W
θJC
Thermal Resistance: Junction-to-Case
P3
4
°C/W
θJ-PCB
Thermal Resistance: Junction-to-Mounting Surface
35
(1)
°C/W
PD
Power Dissipation, TA = 25°C
2.8
(1)
W
Note:
1.
Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 25. Actual results
are dependent on mounting method and surface related to the design.


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