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LM235D Fiches technique(PDF) 11 Page - STMicroelectronics |
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LM235D Fiches technique(HTML) 11 Page - STMicroelectronics |
11 / 16 page LM135-LM235-LM335 Package information 11/16 6 Package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 6.1 TO-92 tape & reel package information Figure 23. TO-92 tape & reel package mechanical drawing A1 P P T H d D0 F1 F2 P2 P0 |
Numéro de pièce similaire - LM235D |
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Description similaire - LM235D |
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