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BD2425J50200A00 Fiches technique(PDF) 4 Page - Anaren Microwave |
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BD2425J50200A00 Fiches technique(HTML) 4 Page - Anaren Microwave |
4 / 6 page USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Model BD2425J50200A00 Rev B Mounting Configuration: In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet published specifications. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/ oC. An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances. No Bias Footprint 0805 Standard Mounting Footprint Dimensions are in Inches [Millimeters] .029 [0.73] 6X .002 [0.05] 6X .011 [0.27] 4X .012 [0.30] Plated thru hole to ground 3X Transmission Line Circuit Pattern Footprint Pad (s) Solder Resist 6X .014 [0.35] Part Orientation (Top View) DC Bias Footprint DC Bias .026 [0.66] 4X .012 [0.30] 6X .013 [0.33] 6X .016 [0.35] Part Orientation (Top View) 0805 DC Bias Mounting Footprint Dimensions are in Inches [Millimeters] 6X .002 [0.05] Plated thru hole to ground 3X Transmission Line Circuit Pattern Footprint Pad (s) Solder Resist |
Numéro de pièce similaire - BD2425J50200A00 |
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Description similaire - BD2425J50200A00 |
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