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ST14C02C-S41 Fiches technique(PDF) 2 Page - STMicroelectronics |
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ST14C02C-S41 Fiches technique(HTML) 2 Page - STMicroelectronics |
2 / 12 page ST14C02C 2/12 Figure 2. D15 Contact Connections AI02492 VCC GND SCL SDA Figure 3. D20 Contact Connections AI02491 VCC GND SCL SDA MODE The memory behaves as a slave device in the I2C protocol, with all memory operations synchronized by the serial clock. Read and write operations are initiated by a START condition, generated by the bus master. The START condition is followed by the Device Select Code which is composed of a stream of 7 bits (1010000), plus one read/write bit (R/W) and is terminated by an acknowledge bit. When writing data to the memory, the memory in- serts an acknowledge bit during the 9th bit time, following the bus master’s 8-bit transmission. When data is read by the bus master, the bus master acknowledges the receipt of the data byte in the same way. Data transfers are terminated by a STOP condition after an Ack for WRITE, and af- ter a NoACK for READ. Power On Reset: VCC Lock-Out Write Protect In order to prevent data corruption and inadvertent write operations during power up, a Power On Re- set (POR) circuit is included. The internal reset is held active until the VCC voltage has reached the POR threshold value, and all operations are dis- abled – the device will not respond to any com- mand. In the same way, when VCC drops from the operating voltage, below the POR threshold value, all operations are disabled and the device will not respond to any command. A stable and valid VCC must be applied before applying any logic signal. Table 2. Absolute Maximum Ratings 1 Note: 1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi- tions for extended periods may affect device reliability. Refer also to the ST SURE Program and other relevant quality documents. 2. MIL-STD-883C, 3015.7 (100 pF, 1500 Ω) 3. EIAJ IC-121 (Condition C) (200 pF, 0 Ω) Symbol Parameter Value Unit TA Ambient Operating Temperature 0 to 70 °C TSTG Storage Temperature Wafer form Module form -65 to 150 -40 to 120 °C VIO Input or Output range -0.3 to 6.5 V VCC Supply Voltage -0.3 to 6.5 V VESD Electrostatic Discharge Voltage (Human Body model) 2 4000 V Electrostatic Discharge Voltage (Machine model) 3 500 V |
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