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ST14C02C-S21 Fiches technique(PDF) 11 Page - STMicroelectronics |
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ST14C02C-S21 Fiches technique(HTML) 11 Page - STMicroelectronics |
11 / 12 page 11/12 ST14C02C Table 10. Ordering Information Scheme Example: ST14C02C - D20 Delivery Form D15 Module on Super 35 mm film D20 Module on Super 35 mm film W2 Unsawn wafer (275 µm ± 25 µm thickness) W4 Unsawn wafer (180 µm ± 15 µm thickness) S2x Sawn wafer (275 µm ± 25 µm thickness) S4x Sawn wafer (180 µm ± 15 µm thickness) where “x” indicates the sawing orientation, as follows (and as shown in Figure 11) 1 GND at top right 2 GND at bottom right 3 GND at bottom left 4 GND at top left Figure 11. Sawing Orientation AI02171 1 ORIENTATION GND GND GND GND 23 4 VIEW: WAFER FRONT SIDE |
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