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ST14C02C-W4 Fiches technique(PDF) 10 Page - STMicroelectronics

No de pièce ST14C02C-W4
Description  Memory Card IC 2 Kbit 256 x 8 Serial I2C Bus EEPROM
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST14C02C-W4 Fiches technique(HTML) 10 Page - STMicroelectronics

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ST14C02C
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Figure 10. AC Waveforms
SCL
SDA IN
SCL
SDA OUT
SCL
SDA IN
tCHCL
tDLCL
tCHDX
START
CONDITION
tCLCH
tDXCX
tCLDX
SDA
INPUT
SDA
CHANGE
tCHDH
tDHDL
STOP &
BUS FREE
DATA VALID
tCLQV
tCLQX
DATA OUTPUT
tCHDH
STOP
CONDITION
tCHDX
START
CONDITION
WRITE CYCLE
tW
AI00795B
ORDERING INFORMATION
Devices are shipped from the factory with the
memory content set at all ‘1’s (FFh).
The notation used for the device number is as
shown in Table 10. For a list of available options
(speed, package, etc...) or for further information
on any aspect of this device, please contact the ST
Sales Office nearest to you.
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
es of the frame (as shown in Figure 11). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
– two months, if wafers are stored at 25°C, 55%
relative humidity
– six months, if wafers are stored at 4°C, 55% rel-
ative humidity


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