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ST1284-02A8 Fiches technique(PDF) 7 Page - STMicroelectronics

No de pièce ST1284-02A8
Description  PARALLEL PORT SINGLE TERMINATION NETWORK WITH 짹15kV ESD PROTECTION
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST1284-02A8 Fiches technique(HTML) 7 Page - STMicroelectronics

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ST1284-xxA8/T8
7/7
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-
proval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2002 STMicroelectronics - Printed in Italy - All rights reserved.
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http://www.st.com
Order code
Marking
Package
Weight
Delivery mode
Base qty
ST1284-01A8
ST1284-01
QSOP28
0.147 g
Tube
48
ST1284-01A8RL
ST1284-01
QSOP28
0.147 g
Tape & Reel
2500
ST1284-02A8
ST1284-02
QSOP28
0.147 g
Tube
48
ST1284-02A8RL
ST1284-02
QSOP28
0.147 g
Tape & Reel
2500
ST1284-03A8RL
ST1284-03
QSOP28
0.147 g
Tape & Reel
2500
ST1284-01T8RL
ST1284-01
TSSOP28
0.104 g
Tape & Reel
2500
ST1284-02T8RL
ST1284-02
TSSOP28
0.104 g
Tape & Reel
2500
ST1284-03T8RL
ST1284-03
TSSOP28
0.104 g
Tape & Reel
2500
dim in mm
0.4
7.1
3.7
0.65
1.7
FOOTPRINT (QSOP28 / TSSOP28)
Package General Specifications
Lead Plating
Tin-Lead
Lead Plating
Thickness
7
µm Min
20
µm Max
Lead Material
Copper Alloy
Lead Coplanarity
0.102 mm (0.004")
Body Material
Molded Epoxy
Resine
Meets UL94V.0 standard


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