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TSC2008IYZGT Fiches technique(PDF) 2 Page - Texas Instruments |
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TSC2008IYZGT Fiches technique(HTML) 2 Page - Texas Instruments |
2 / 8 page ABSOLUTE MAXIMUM RATINGS (1) TSC2008 SBAS406 – JUNE 2008 ...................................................................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TYPICAL TYPICAL NO MISSING INTEGRAL GAIN CODES SPECIFIED TRANSPORT LINEARITY ERROR RESOLUTION PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) (BITS) TYPE DESIGNATOR RANGE MARKING NUMBER QUANTITY Small Tape TSC2008RGVT 16-Pin, and Reel, 250 4 x 4 RGV –40°C to +85°C TSC2008I Tape and QFN TSC2008RGVR Reel, 25000 TSC2008I ±1.5 –0.2/+4.4 11 Small Tape 12-Pin, TSC2008IYZGT and Reel, 250 3 x 4 Matrix, YZG –40°C to +85°C TSC2008I 1.5 x 2 Tape and TSC2008IYZGR WCSP Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI website at www.ti.com. Over operating free-air temperature range (unless otherwise noted). PARAMETER TSC2008 UNIT Analog input X+, Y+, AUX to GND –0.4 to VDD + 0.1 V Voltage Analog input X–, Y– to GND –0.4 to VDD + 0.1 V Voltage range VDD to GND –0.3 to +5 V Digital input voltage to GND –0.3 to VDD + 0.3 V Digital output voltage to GND –0.3 to VDD + 0.3 V Power dissipation (TJ Max - TA)/θJA QFN package 47 °C/W Thermal impedance, θ JA Low-K 113 °C/W WCSP High-K 62 °C/W Operating free-air temperature range, TA –40 to +85 °C Storage temperature range, TSTG –65 to +150 °C Junction temperature, TJ Max +150 °C Vapor phase (60 sec) +215 °C Lead temperature Infrared (15 sec) +220 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TSC2008 |
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