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CD74HC563ME4 Fiches technique(PDF) 9 Page - Texas Instruments

No de pièce CD74HC563ME4
Description  High-Speed CMOS Logic Octal Inverting Transparent Latch, Three-State Outputs
Download  14 Pages
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Fabricant  TI [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI - Texas Instruments

CD74HC563ME4 Fiches technique(HTML) 9 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-8606201RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
5962-8681301RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC533F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC563F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT533F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC533E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC533EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC563E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC563EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC563M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC563ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC563MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT533E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT533EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT563E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT563EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT563M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT563ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT563MG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Addendum-Page 1


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