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AMC1203BDWR Fiches technique(PDF) 4 Page - Texas Instruments |
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AMC1203BDWR Fiches technique(HTML) 4 Page - Texas Instruments |
4 / 23 page www.ti.com PACKAGE CHARACTERISTICS (1) IEC SAFETY LIMITING VALUES IEC 61000-4-5 RATINGS IEC 60664-1 RATINGS AMC1203 SBAS427 – FEBRUARY 2008 Over recommended operating conditions, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Shortest terminal to terminal distance L(I01) Minimum air gap (clearance) 7.0 mm through air Shortest terminal to terminal distance L(I02) Minimum external tracking (creepage) 7.0 mm across the package surface Tracking resistance (comparative CTI DIN IEC 60112 / VDE 0303 Part 1 ≥ 175 V tracking index) Minimum internal gap (internal Distance through the insulation 0.008 mm clearance) Input to output, VIO = 500V, all pins on each side of the barrier tied together > 1012 Ω creating a two-terminal device, TA < +85°C RIO Isolation resistance Input to output, VIO = 500V, > 1011 Ω +100 °C ≤ T A < TA max CIO Barrier capacitance input to output VI = 0.8VPP at 1MHz 1.2 pF CI Input capacitance to ground VI = 0.8VPP at 1MHz 3 pF (1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance. Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures. The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IS Safety input, output, or supply current θ JA = 246°C/W, VI = 5.5V, TJ = +150°C, TA = +25°C 90 mA TC Maximum case temperature +150 °C PARAMETER TEST CONDITIONS VALUE UNIT Surge immunity 1.2/50 µs voltage surge and 8/20µs current surge ±6000 V PARAMETER TEST CONDITIONS SPECIFICATION Basic isolation group Material group IIIa Rated mains voltage ≤ 150 VRMS I-IV Installation classification Rated mains voltage < 300 VRMS I-III 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): AMC1203 |
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