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LM2678SDX-3.3 Fiches technique(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
No de pièce LM2678SDX-3.3
Description  SIMPLE SWITCHER짰 High Efficiency 5A Step-Down Voltage Regulator
Download  27 Pages
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Fabricant  NSC [National Semiconductor (TI)]
Site Internet  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2678SDX-3.3 Fiches technique(HTML) 5 Page - National Semiconductor (TI)

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All Output Voltage Versions
Electrical Characteristics (Continued)
Note 4: All limits are guaranteed at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100%
tested during production with TA =TJ = 25˚C. All limits at temperature extremes are guaranteed via correlation using standard standard Quality Control (SQC)
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 5: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with 12 inch leads in a socket, or on a PC
board with minimum copper area.
Note 6: Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with 12 inch leads soldered to a PC board
containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
Note 7: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the
TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 8: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area
of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 9: Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the
area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers
Made Simple® software.
Note 10: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area equal to the die attach paddle.
Note 11: Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area using 12 vias to a second layer of copper equal to die
attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187.
www.national.com
5


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